FemtoGLASS

Glass cutting and dicing workstation for industry

The FemtoGLASS is a new glass & sapphire laser dicing workstation ideal for research & development, and volume manufacturing. The technology outperforms other glass-cutting methods, thus is very well applicable in semiconductors, microfluidics, and micro-optics industries.
Features:
• Ultra-thin (30 µm to 2 mm in a single pass) cutting
• High process speed – up to 800 mm/s
• All shapes: circular, square, irregular